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MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND ......................... -0.3V to (V CC + 0.3V)
RF, LO Input Power ....................................................... +20dBm
IF Input Power (50ω source) ......................................... +18dBm
RF, LO Current (RF and LO are DC shorted to
GND through a balun) ....................................................50mA
Operating Case Temperature Range (Note 1) ....... -40 N C to +85 N C
Continuous Power Dissipation (Note 2) ..............................5.0W
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering 10s) .................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Note 2: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient
Thermal Resistance B JA (Notes 3, 4) ....................... +38°C/W
Junction-to-Case
Thermal Resistance B JC (Notes 2, 4) ....................... +13°C/W
Note 3: Junction temperature T J = T A + ( B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = 4.75V to 5.25V, no input AC signals. T C = -40 N C to +85 N C, unless otherwise noted. Typical values
are at V CC = 5.0V, T C = +25 N C.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5
140
MAX
5.25
162
UNITS
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = 3.0V to 3.6V, no input AC applied. T C = -40 N C to +85 N C, unless otherwise noted. Typical values
are at V CC = 3.3V, T C = +25 N C.)
PARAMETER
Supply Voltage
SYMBOL
V CC
CONDITIONS
MIN
3.0
TYP
3.3
MAX
3.6
UNITS
V
Supply Current
I CC
122
mA
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